The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2021

Filed:

May. 11, 2018
Applicant:

Ngk Spark Plug Co., Ltd., Nagoya, JP;

Inventors:

Takahiro Hayashi, Nagoya, JP;

Takuya Hando, Nagoya, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/12 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/116 (2013.01); H05K 1/0271 (2013.01); H05K 2201/097 (2013.01); H05K 2201/0979 (2013.01); H05K 2201/09409 (2013.01); H05K 2201/09454 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/09636 (2013.01); H05K 2201/09672 (2013.01);
Abstract

A wiring board includes: a wiring-board body including a first surface and a second surface opposite to the first surface, and including at least one insulator layer; pads formed at at least one of an internal layer boundary plane and the first surface and the second surface defining a first plane; and via conductors connected to corresponding ones of the pads, and arranged in parallel to extend in a thickness direction of the wiring-board body. Each of first and second ones of the pads adjacent to each other in planar view at the first plane is connected to corresponding ones of the via conductors. The via conductors corresponding to the first pad are arranged differently from the via conductors corresponding to the second pad, in planar view.


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