The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10903619 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 26, 2021

Filed:

May. 17, 2017
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventor:

Kazuhisa Takagi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S 5/062 (2006.01); H01S 5/022 (2006.01); H01L 31/173 (2006.01); H01S 5/40 (2006.01); H01S 5/0625 (2006.01); G02B 6/42 (2006.01); H01L 23/00 (2006.01); H01B 11/18 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02276 (2013.01); G02B 6/4263 (2013.01); H01L 31/173 (2013.01); H01S 5/02212 (2013.01); H01S 5/02244 (2013.01); H01S 5/06253 (2013.01); H01S 5/4087 (2013.01); H01B 11/18 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/4557 (2013.01);
Abstract

A multi-wavelength integrated device () including plural semiconductor lasers () and plural modulators () modulating output beams of the plural semiconductor lasers () respectively is mounted on the stem (). Plural leads () penetrates through the stem () and are connected to the plural semiconductor lasers () and the plural modulators () respectively. Each lead () is a coaxial line in which plural layers are concentrically overlapped with one another. The coaxial line includes a high frequency signal line () transmitting a high frequency signal to the modulator (), a GND line (), and a feed line () feeding a DC current to the semiconductor laser (). The high frequency signal line () is arranged at a center of the coaxial line. The GND line () and the feed line () are arranged outside the high frequency signal line ().


Find Patent Forward Citations

Takagi, Kazuhisa. (2021). Semiconductor package (U.S. Patent No. 10903619). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10903619

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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