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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10903548 B1

PDFFull Text
Date of Patent:
Jan. 26, 2021

Filed:

May. 13, 2019

Antenna module

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Yong Koon Lee, Suwon-si, KR;

Jin Su Kim, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO.. LTD., Suwon-si, KR;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Tung X Le

Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 1/48 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/367 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01Q 9/16 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 23/3677 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01Q 1/48 (2013.01); H01Q 9/16 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/214 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01);
Abstract

An antenna module includes an antenna substrate having a first surface and a second surface disposed to oppose each other, and including a substrate wiring layer having a first antenna pattern positioned in a first region, a second antenna pattern disposed in a second region adjacent to one side, and first and second feed patterns connected to the first and second antenna patterns, respectively; and a semiconductor package including a connection structure disposed on the second surface except for an area overlapping with the second region of the antenna substrate and redistribution layers electrically connected to the substrate wiring layer, and at least one semiconductor chip having connection pads connected to the redistribution layers. A region overlapping with the second feed pattern in each of the plurality of redistribution layers is provided as an opened region.

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