The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2021
Filed:
Dec. 06, 2016
Applicant:
Cray Inc., Seattle, WA (US);
Inventor:
Andy Becker, Eau Claire, WI (US);
Assignee:
Hewlett Packard Enterprise Development LP, Houston, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01); H01P 3/02 (2006.01); H05K 1/02 (2006.01); H01P 11/00 (2006.01);
U.S. Cl.
CPC ...
H01P 3/026 (2013.01); H01P 3/08 (2013.01); H05K 1/025 (2013.01); H05K 1/0219 (2013.01); H05K 1/0237 (2013.01); H01P 11/003 (2013.01); H05K 2203/0307 (2013.01);
Abstract
Signal transmission structures within a printed circuit are formed to have reduced loss by making specific accommodations to reduce the surface roughness of an adjacent power plane, and thereby reducing the effects of magnetically induced currents. The power plane structure will retain sufficient surface roughness to accommodate manufacturing operations, while also contributing to reduced signal transmission losses in the adjacent signal transmission structure. The transmission structures thereby being capable of more efficiently transmitting high speed signals without undesired attenuation and loss.