The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2021

Filed:

Feb. 25, 2020
Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

Walid M. Al-Bondak, View Park, CA (US);

Kyu-Pyung Hwang, Ladson, SC (US);

Young Kyu Song, El Segundo, CA (US);

Assignee:

THE BOEING COMPANY, Chicago, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 1/22 (2006.01); H01P 3/08 (2006.01); H01P 11/00 (2006.01); H03F 3/19 (2006.01);
U.S. Cl.
CPC ...
H01P 1/227 (2013.01); H01P 3/081 (2013.01); H01P 11/003 (2013.01); H03F 3/19 (2013.01); H03F 2200/451 (2013.01);
Abstract

A variable RF attenuator includes a substrate, a first microstrip trace, a first thin film resistor, a second microstrip trace, and a wire bond. The substrate includes a dielectric layer. The first thin film resistor is disposed on the substrate. The first microstrip trace is disposed on the substrate and the first thin film resistor. The second microstrip trace is disposed on the substrate and is uncoupled from the first microstrip trace. The wire bond extends from the second microstrip trace to a position on the first microstrip trace. The position is selected to tune RF attenuation over a conductive path defined by the first microstrip trace, the wire bond, and the second microstrip trace.


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