The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2021

Filed:

Jan. 22, 2019
Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota, JP;

Inventors:

Koji Torita, Nagoya, JP;

Harunari Shimamura, Toyonaka, JP;

Yusuke Fukumoto, Toyonaka, JP;

Akihiro Ochiai, Toyonaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/66 (2006.01); H01M 10/0525 (2010.01); H01M 10/0587 (2010.01); H01M 4/70 (2006.01); H01M 4/13 (2010.01); H01M 4/02 (2006.01);
U.S. Cl.
CPC ...
H01M 10/0525 (2013.01); H01M 4/13 (2013.01); H01M 4/667 (2013.01); H01M 4/668 (2013.01); H01M 4/70 (2013.01); H01M 10/0587 (2013.01); H01M 2004/021 (2013.01); H01M 2004/027 (2013.01); H01M 2004/028 (2013.01);
Abstract

A non-aqueous electrolyte secondary battery includes at least a positive electrode, a negative electrode, a separator, and a non-aqueous electrolyte. The positive electrode includes a positive electrode current collector, a protection layer, and a positive electrode composite material layer. The protection layer, arranged between the positive electrode current collector and positive electrode composite material layer, includes at least a first and second protection layer. The first protection layer, arranged on a surface of the positive electrode current collector, contains a first conductive material and a first resin being a non-thermoplastic polyimide resin. The second protection layer, arranged on a surface of the first protection layer, contains at least a second conductive material and a resin A being a thermoplastic resin. A melting point of the resin A is lower than a thermal decomposition temperature of the first resin. The resin A is greater in expansion coefficient than the first resin.


Find Patent Forward Citations

Loading…