The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2021

Filed:

Feb. 04, 2019
Applicant:

United Technologies Corporation, Farmington, CT (US);

Inventors:

Sameh Dardona, South Windsor, CT (US);

Dustin D. Caldwell, Portland, CT (US);

Callum Bailey, West Hartford, CT (US);

Assignee:

United Technologies Corporation, Farmington, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/113 (2006.01); H05K 1/02 (2006.01); H05K 1/16 (2006.01); H05K 3/00 (2006.01); H01L 41/317 (2013.01); H01L 41/047 (2006.01); H01L 27/20 (2006.01); H01L 41/053 (2006.01); H05K 3/12 (2006.01); H01L 21/683 (2006.01); G01M 5/00 (2006.01); H01L 41/29 (2013.01);
U.S. Cl.
CPC ...
H01L 41/1132 (2013.01); G01M 5/0083 (2013.01); H01L 21/6835 (2013.01); H01L 27/20 (2013.01); H01L 41/0475 (2013.01); H01L 41/0533 (2013.01); H01L 41/29 (2013.01); H01L 41/317 (2013.01); H05K 1/0277 (2013.01); H05K 1/16 (2013.01); H05K 3/007 (2013.01); H05K 3/1283 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68381 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1131 (2013.01);
Abstract

A method of additively-manufacturing a flexible sensor system having a lattice topology includes a number of electrical interconnects, each having one or more electrically-conductive layers alternately sandwiched between two or more dielectric layers, and two or more sensors defining a sensor array, each sensor located at an intersection of and electrically connected to the interconnects on the lattice topology and electrically-connected to the interconnects. Each of the electrically-conductive layers includes a cured material base and silver, copper, aluminum, gold, platinum, ruthenium, carbon, and/or alloys thereof, and each of the dielectric layers includes a cured material base. The additively-manufactured flexible sensor system is configured to be installed on the surface of an asset for the monitoring of that asset.


Find Patent Forward Citations

Loading…