The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2021

Filed:

Jul. 20, 2016
Applicant:

Osram Oled Gmbh, Regensburg, DE;

Inventor:

Martin Unterburger, Sünching, DE;

Assignee:

OSRAM OLED GmbH, Regensburg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 33/54 (2010.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 33/44 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 24/13 (2013.01); H01L 33/44 (2013.01); H01L 33/486 (2013.01); H01L 33/54 (2013.01); H01L 33/647 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68377 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/1163 (2013.01); H01L 2224/11602 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/19 (2013.01); H01L 2224/2402 (2013.01); H01L 2224/82101 (2013.01); H01L 2224/82106 (2013.01); H01L 2924/18162 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0075 (2013.01);
Abstract

A method for producing a component having a semiconductor body includes providing the semiconductor body including a radiation passage surface and a rear side facing away from the radiation passage surface, wherein the semiconductor body comprises on the rear side a connection location for the electrical contacting of the semiconductor body, providing a composite carrier including a carrier layer and a partly cured connecting layer, applying the semiconductor body on the composite carrier, such that the connection location penetrates into the partly cured connecting layer, curing the connecting layer to form a solid composite, applying a molded body material on the composite carrier after curing the connecting layer, wherein the molded body covers side surfaces of the semiconductor body, forming a cutout through the carrier layer and the connecting layer in order to expose the connection location, and filling the cutout with an electrically conductive material.


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