The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2021
Filed:
Feb. 13, 2018
Applicant:
Wisconsin Alumni Research Foundation, Madison, WI (US);
Inventors:
Zhenqiang Ma, Middleton, WI (US);
Yei Hwan Jung, Seoul, KR;
Assignee:
Wisconsin Alumni Research Foundation, Madison, WI (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/423 (2006.01); H01L 21/308 (2006.01); H01L 23/00 (2006.01); H01L 29/778 (2006.01); H01L 21/283 (2006.01); H01L 21/28 (2006.01); H01L 21/768 (2006.01); H01L 29/40 (2006.01); H01L 29/66 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 29/42376 (2013.01); H01L 21/283 (2013.01); H01L 21/28114 (2013.01); H01L 21/3086 (2013.01); H01L 21/76885 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 29/401 (2013.01); H01L 29/42316 (2013.01); H01L 29/778 (2013.01); H01L 29/2003 (2013.01); H01L 29/66462 (2013.01); H01L 29/7786 (2013.01); H01L 2224/03472 (2013.01); H01L 2224/05016 (2013.01);
Abstract
Patterning methods for forming patterned device substrates are provided. Also provided are devices made using the methods. The methods utilize photoresist features have re-entrant profiles to form a secondary metal hard mask that can be used to pattern an underlying device substrate.