The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2021
Filed:
Apr. 04, 2019
Applicants:
Bor-jen Wu, New Taipei, TW;
Chia-bin Tsen, New Taipei, TW;
Inventors:
Bor-Jen Wu, New Taipei, TW;
Chia-Bin Tsen, New Taipei, TW;
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 33/00 (2010.01); H01L 33/32 (2010.01); H01L 33/62 (2010.01); H01L 33/50 (2010.01); H01L 33/44 (2010.01);
U.S. Cl.
CPC ...
H01L 27/156 (2013.01); H01L 33/007 (2013.01); H01L 33/32 (2013.01); H01L 33/44 (2013.01); H01L 33/50 (2013.01); H01L 33/62 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0066 (2013.01);
Abstract
By using chip-by-chip, mainly separation technology, micro LED can be made very accurately and efficiently. First, after epitaxial process, the LED epi-wafer is processed into micro LEDs. Second, bonding substrates with driving circuits are provided for the LED epi-wafer. Then, each LED chip is fastened to the substrate chip-by-chip simultaneously or sequentially, and each LED chip may be transferred by using separation technology simultaneously or sequentially. The LED epi-wafer per se can be also provided as LED display substrate.