The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2021
Filed:
Dec. 22, 2016
Applicant:
Hyundai Autron Co., Ltd., Seongnam-si, KR;
Inventors:
Assignee:
Hyundai Autron Co., Ltd., Seoul, KR;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 25/065 (2006.01); G06F 30/39 (2020.01); G06F 30/398 (2020.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); G06F 30/39 (2020.01); G06F 30/398 (2020.01); H01L 21/78 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 2924/0002 (2013.01);
Abstract
The present invention relates to a method for designing a die-based vehicle controller-only semiconductor and a vehicle controller-only semiconductor manufactured by the same, and breaks the conventional semiconductor process to design and manufacture a novel conceptual vehicle controller-only semiconductor, EIP (ECU in Package), through a fusion of a new semiconductor process technique with a controller system technique, thereby obtaining an effect of capable of implementing a high performance/high quality semiconductor in micro-miniature size/ultra-light weight in a short time period.