The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2021
Filed:
Nov. 15, 2019
Applicant:
SK Hynix Inc., Icheon-si, KR;
Inventor:
Sun Myung Choi, Seoul, KR;
Assignee:
SK hynix Inc., Icheon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 25/065 (2006.01); G11C 7/10 (2006.01); G11C 29/44 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); G11C 7/1069 (2013.01); G11C 7/1096 (2013.01); G11C 29/4401 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06596 (2013.01);
Abstract
A semiconductor chip includes a first semiconductor device and a second semiconductor device stacked and coupled through a unidirectional through electrode and a plurality of bidirectional through electrodes, wherein a through electrode in which a failure has occurred among the unidirectional through electrode and the plurality of bidirectional through electrodes is replaced based on a plurality of transfer control signals. The plurality of transfer control signals including failure information on the unidirectional through electrode and the plurality of bidirectional through electrodes.