Electrode connection structure, lead frame, and method for forming electrode connection structure

Abstract

[Problem] To provide an electrode connection structure and the like in which a plurality of elongated leads are arranged in parallel and a longitudinal side surface of each lead is connected to an electrode by plating treatment with high quality. [Solution] An electrode connection structure in which a semiconductor chipelectrode and/or a substrate electrode is connected to a plurality of elongated leadsof a lead frameby plating. The plurality of elongated leadsof the lead frameare arranged in parallel, and a longitudinal side surface of each leadis connected to the semiconductor chipelectrode and/or the substrate electrode by plating. At a connection portion of a first connection surfaceof the semiconductor chipelectrode and/or the substrate electrode, the first connection surfacebeing connected to the leads, and a second connection surfacein the longitudinal side surface of each lead, the second connection surfacebeing connected to the first connection surface, a distance between the first connection surfaceand the second connection surfacecontinuously increases from an edge portionof the second connection surface, the edge portionbeing in contact with the first connection surface, toward an outer portionof the second connection surface