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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10903130 B1

PDFFull Text
Date of Patent:
Jan. 26, 2021

Filed:

Aug. 30, 2017

Semiconductor apparatus and manufacturing method of semiconductor apparatus

Applicant:

Fuji Electric Co., Ltd., Kanagawa, JP;

Inventors:

Yoko Nakamura, Matsumoto, JP;

Norihiro Nashida, Kita-azumi-gun, JP;

Yuichiro Hinata, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:

Jesse Y Miyoshi

Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/16 (2006.01); H01L 21/56 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01); H01L 25/00 (2006.01); H01L 25/16 (2006.01); H01L 25/18 (2006.01); H01L 23/24 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/053 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3121 (2013.01); H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 23/053 (2013.01); H01L 23/10 (2013.01); H01L 23/16 (2013.01); H01L 23/24 (2013.01); H01L 23/315 (2013.01); H01L 23/3142 (2013.01); H01L 23/3735 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/5385 (2013.01); H01L 23/562 (2013.01); H01L 25/072 (2013.01); H01L 25/50 (2013.01); H01L 23/49811 (2013.01); H01L 25/162 (2013.01); H01L 25/18 (2013.01); H01L 2224/32225 (2013.01);
Abstract

A semiconductor apparatusincludes a circuit substratehaving a circuit pattern layeron an upper principal surface, semiconductor elementsandmounted on the circuit pattern layerof the circuit substrate, a printed substratearranged apart from the circuit substrateon the upper principal surface side of the circuit substrate, a housingmold-sealing the upper principal surface side of the circuit substrate, and a blockprovided sandwiching at least part of the housingand being opposite to the circuit substrate, the block having a linear expansion coefficient smaller than that of the housing

Find Patent Forward Citations

Nakamura, Yoko. (2021). Semiconductor apparatus and manufacturing method of semiconductor apparatus (U.S. Patent No. 10903130). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10903130

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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