The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2021

Filed:

Nov. 28, 2018
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventor:

Yong Won Seo, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01G 4/12 (2006.01); H01G 4/008 (2006.01); H01G 2/04 (2006.01); H01G 2/02 (2006.01); H01G 2/06 (2006.01);
U.S. Cl.
CPC ...
H01G 4/232 (2013.01); H01G 4/008 (2013.01); H01G 4/12 (2013.01); H01G 4/30 (2013.01); H01G 2/02 (2013.01); H01G 2/04 (2013.01); H01G 2/06 (2013.01);
Abstract

A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and first and second internal electrodes; and first and second external electrodes, wherein the first and second external electrodes include first and second base electrode layers being at least partially in contact with the first and second external surfaces of the ceramic body, first and second nickel plating layers disposed to cover the first and second base electrode layers, and first and second tin plating layers disposed to cover the first and second nickel plating layers, respectively, and wherein a thickness of a center portion of each of the first and second tin plating layers exceeds 5 μm.


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