The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2021

Filed:

Feb. 07, 2019
Applicant:

Taiyo Yuden Co., Ltd., Tokyo, JP;

Inventors:

Daisuke Sakate, Tokyo, JP;

Kotaro Mizuno, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/224 (2006.01); H01G 4/30 (2006.01); H01G 4/12 (2006.01); B32B 37/02 (2006.01); H01G 4/008 (2006.01); B32B 37/10 (2006.01); B32B 38/18 (2006.01);
U.S. Cl.
CPC ...
H01G 4/224 (2013.01); B32B 37/02 (2013.01); B32B 37/10 (2013.01); B32B 38/1808 (2013.01); H01G 4/008 (2013.01); H01G 4/12 (2013.01); H01G 4/30 (2013.01); B32B 2307/202 (2013.01); B32B 2307/204 (2013.01); B32B 2307/206 (2013.01); B32B 2315/02 (2013.01); B32B 2457/16 (2013.01);
Abstract

A multi-layer ceramic electronic component includes a multi-layer unit and a side margin. The multi-layer unit includes a capacitance forming unit, a cover, and a side surface. The capacitance forming unit includes ceramic layers that are laminated in a first direction and contain boron, and internal electrodes disposed between the ceramic layers. The cover covers the capacitance forming unit in the first direction. The side surface faces in a second direction orthogonal to the first direction. The side margin covers the side surface in the second direction and has a lower boron concentration than a boron concentration of the ceramic layers.


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