The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2021
Filed:
May. 04, 2016
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Woon Chul Choi, Suwon-si, KR;
Jung Hyuk Jung, Suwon-si, KR;
Woo Jin Lee, Suwon-si, KR;
Han Wool Ryu, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 17/00 (2006.01); H01F 17/04 (2006.01); H01F 27/29 (2006.01); H01F 41/04 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 27/292 (2013.01); H01F 41/046 (2013.01); H01F 2017/048 (2013.01);
Abstract
A coil electronic component includes a magnetic body that includes a substrate and a coil part. The coil part includes patterned insulating films disposed on a surface of the substrate and a plating layer formed between the patterned insulating films by plating and having a thickness greater than or equal to its width measured parallel to the surface of the substrate. The plating layer may be formed in a single plating operation, and may have a thickness of 200 μm or more.