The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2021

Filed:

Jan. 29, 2015
Applicant:

Dexerials Corporation, Tokyo, JP;

Inventor:

Kumiko Kitamura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 7/02 (2019.01); H01B 5/14 (2006.01); B32B 27/08 (2006.01); B32B 27/16 (2006.01); B32B 27/20 (2006.01); B32B 27/30 (2006.01); B32B 27/38 (2006.01); B32B 37/14 (2006.01); B32B 37/16 (2006.01); H01B 13/00 (2006.01); H01R 4/04 (2006.01); H01R 13/24 (2006.01); H05K 3/32 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01B 5/14 (2013.01); B32B 27/08 (2013.01); B32B 27/16 (2013.01); B32B 27/20 (2013.01); B32B 27/308 (2013.01); B32B 27/38 (2013.01); B32B 37/144 (2013.01); B32B 37/16 (2013.01); H01B 13/0036 (2013.01); B32B 2250/03 (2013.01); B32B 2250/24 (2013.01); B32B 2255/10 (2013.01); B32B 2270/00 (2013.01); B32B 2307/202 (2013.01); B32B 2307/206 (2013.01); B32B 2307/51 (2013.01); B32B 2307/704 (2013.01); B32B 2310/0831 (2013.01); B32B 2333/00 (2013.01); B32B 2363/00 (2013.01); B32B 2457/00 (2013.01); H01L 24/29 (2013.01); H01R 4/04 (2013.01); H01R 13/2414 (2013.01); H05K 3/323 (2013.01);
Abstract

An anisotropic conductive film has a first insulating resin layer and a second insulating resin layer. The first insulating resin layer is formed of a photopolymerized resin, the second insulating resin layer is formed of a thermo-cationically or thermo-anionically polymerizable resin, a photo-cationically or photo-anionically polymerizable resin, a thermo-radically polymerizable resin, or a photo-radically polymerizable resin, and conductive particles for anisotropic conductive connection are disposed in a single layer on a surface of the first insulating resin layer on a side of the second insulating resin layer. The elastic modulus of the anisotropic conductive film as a whole is 0.13 MPa or more.


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Kitamura, Kumiko. (2021). Anisotropic conductive film and production method of the same (U.S. Patent No. 10902973). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10902973

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