The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2021

Filed:

Jan. 04, 2018
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jong-pil Lee, Suwon-si, KR;

Bong-il Park, Seongnam-si, KR;

Moon-su Kim, Gimpo-si, KR;

Sun-ik Heo, Hwaseong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/3323 (2020.01); G06F 30/392 (2020.01); G06F 30/394 (2020.01); G06F 30/398 (2020.01); G06F 30/3312 (2020.01); G06F 111/04 (2020.01); G06F 111/20 (2020.01); G06F 119/06 (2020.01); G06F 119/12 (2020.01);
U.S. Cl.
CPC ...
G06F 30/3323 (2020.01); G06F 30/3312 (2020.01); G06F 30/392 (2020.01); G06F 30/394 (2020.01); G06F 30/398 (2020.01); G06F 2111/04 (2020.01); G06F 2111/20 (2020.01); G06F 2119/06 (2020.01); G06F 2119/12 (2020.01);
Abstract

A computer-implemented method and a computing system for designing an integrated circuit are provided. The method includes generating wire data corresponding to a net included in an integrated circuit, the wire data including metal layer information of a wire corresponding to the net and physical information of the wire, performing timing analysis using the physical information of the wire included in the wire data to generate timing analysis data, and changing a layout of the integrated circuit according to the timing analysis data.


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