The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2021
Filed:
Mar. 06, 2017
Mitsubishi Chemical Engineering Corporation, Tokyo, JP;
Kouji Kawano, Tokyo, JP;
Mitsubishi Chemical Engineering Corp., Tokyo, JP;
Abstract
To provide a manufacturing process analysis method for specifying a hindering factor that causes a variation in product performance and for stabilizing product performance. A manufacturing process analysis method comprises: a step for collecting product data indicating the quality of a product and process data indicating manufacturing conditions of a product; a step for standardizing the process data so that the data are converted into an intermediate function; a step for performing principal component analysis on the intermediate function to derive a principal component load amount and a principal component score of the process data; a step for applying cluster analysis to the principal component score to classify manufacturing process lots into a plurality of groups; a step for determining relative merit of each group on the basis of product data soundness corresponding to the principal component score belonging to the group; and a step for specifying a hindering factor that contributes to the relative merit of the group.