The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2021

Filed:

Aug. 13, 2018
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Yousuke Irie, Nara, JP;

Ryoji Hirose, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01M 5/00 (2006.01); G01K 5/56 (2006.01); G01L 1/24 (2006.01); G01M 99/00 (2011.01); G01M 11/08 (2006.01); G01N 25/72 (2006.01); G06T 7/00 (2017.01); G06T 7/20 (2017.01); H04N 5/33 (2006.01); G01G 19/02 (2006.01);
U.S. Cl.
CPC ...
G01K 5/56 (2013.01); G01L 1/248 (2013.01); G01M 5/0008 (2013.01); G01M 5/0091 (2013.01); G01M 11/081 (2013.01); G01M 99/002 (2013.01); G01N 25/72 (2013.01); G06T 7/0004 (2013.01); G06T 7/20 (2013.01); H04N 5/33 (2013.01); G01G 19/022 (2013.01); G06T 2207/10048 (2013.01); G06T 2207/20056 (2013.01); G06T 2207/30132 (2013.01); G06T 2207/30236 (2013.01);
Abstract

A stress distribution measurement method is a method of measuring stress distribution generated on a structural object including two support parts and a beam part provided between the support parts. The method includes: generating first image data by performing, through a first image capturing unit, image capturing of a moving object or an identification display object attached to the structural object from the moving object; calculating, based on the first image data, a movement duration in which the moving object moves between the support parts; generating, as second image data, thermal image data by performing image capturing of the surface of the beam part through a second image capturing unit; calculating a temperature change amount based on a second image data group corresponding to the movement duration; and calculating a stress change amount based on the temperature change amount to calculate stress distribution based on the stress change amount.


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