The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2021

Filed:

May. 31, 2018
Applicant:

Borgwarner Inc., Auburn Hills, MI (US);

Inventor:

Jeffrey Carter, West Yorkshire, GB;

Assignee:

Borg Warner Inc., Auburn Hills, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F02B 39/00 (2006.01); H05K 7/20 (2006.01); H01L 23/473 (2006.01); H05K 1/02 (2006.01); F02M 35/10 (2006.01); F02B 39/10 (2006.01); H02K 9/00 (2006.01); H02K 9/22 (2006.01);
U.S. Cl.
CPC ...
F02B 39/005 (2013.01); F02B 39/10 (2013.01); F02M 35/10157 (2013.01); H01L 23/473 (2013.01); H02K 9/005 (2013.01); H02K 9/22 (2013.01); H05K 1/0203 (2013.01); H05K 7/2039 (2013.01); H05K 7/20218 (2013.01); H05K 7/20254 (2013.01); H05K 7/20872 (2013.01); H05K 7/20927 (2013.01); F05D 2220/40 (2013.01); F05D 2260/22141 (2013.01);
Abstract

An electronics assembly drives an electric motor and receives a coolant fluid. The electronics assembly includes a heat sink including a thermally conductive material. The heat sink includes a frame extending between a first surface and a second surface. The first surface defines at least a portion of a cavity for receiving the coolant fluid therein. The heat sink includes a plurality of cooling members coupled to and extending from the first surface of the frame into the cavity such that the plurality of cooling members are disposed within the coolant fluid. The electronics assembly further includes an electrical insulator directly bonded to the second surface of the frame and a semiconductor thermally coupled to the electrical insulator. The electrical insulator is a thermal conductor and facilitates heat transfer between the semiconductor and the heat sink. The electrical insulator electrically insulates the semiconductor from the heat sink.


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