The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2021

Filed:

Jul. 18, 2017
Applicant:

Honeywell International Inc., Morris Plains, NJ (US);

Inventors:

Qiang Li, Shanghai, CN;

Gangmin Cao, Shanghai, CN;

Assignee:

HONEYWELL INTERNATIONAL INC., Charlotte, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 1/02 (2006.01); B29C 64/40 (2017.01); C25D 1/20 (2006.01); C25D 1/00 (2006.01); B22F 3/105 (2006.01); B29C 64/153 (2017.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); B23P 15/02 (2006.01); B22F 3/24 (2006.01); B22F 5/10 (2006.01); C23F 1/00 (2006.01); B22F 5/00 (2006.01); F01D 5/22 (2006.01); F01D 5/28 (2006.01); F01D 9/02 (2006.01); F01D 25/24 (2006.01); F23R 3/00 (2006.01);
U.S. Cl.
CPC ...
C25D 1/02 (2013.01); B22F 3/1055 (2013.01); B23P 15/02 (2013.01); B29C 64/153 (2017.08); B29C 64/40 (2017.08); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); C25D 1/00 (2013.01); C25D 1/20 (2013.01); B22F 5/009 (2013.01); B22F 2003/242 (2013.01); B22F 2003/247 (2013.01); B22F 2005/103 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); B23P 2700/13 (2013.01); C23F 1/00 (2013.01); F01D 5/225 (2013.01); F01D 5/288 (2013.01); F01D 9/02 (2013.01); F01D 25/24 (2013.01); F05D 2220/32 (2013.01); F05D 2230/31 (2013.01); F23R 3/002 (2013.01);
Abstract

Additive-based electroforming manufacturing methods for producing turbomachine components and other metallic articles are provided, as are metallic articles manufactured utilizing such manufacturing methods. In various embodiments, the method includes the step or process of additively manufacturing a sacrificial tooling structure having a component-defining surface region. A metallic body layer or shell is deposited over the component-defining surface region utilizing an electroforming process such that a geometry of the component-defining surface region is transferred to the body layer. The tooling structure is chemically dissolved, thermally decomposed, or otherwise removed, while the metallic body layer is left substantially intact. After tooling structure removal, the metallic body layer is further processed to complete fabrication of the metallic component. In certain implementations, the method may further include the step or process of depositing an electrically-conductive base coat over the component-defining surface region of the tooling structure for usage in the subsequently-performed electroforming process.


Find Patent Forward Citations

Loading…