The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2021

Filed:

Dec. 26, 2017
Applicant:

Screen Holdings Co., Ltd., Kyoto, JP;

Inventors:

Yuji Tanaka, Kyoto, JP;

Chisayo Nakayama, Kyoto, JP;

Masahiko Harumoto, Kyoto, JP;

Masaya Asai, Kyoto, JP;

Yasuhiro Fukumoto, Kyoto, JP;

Tomohiro Matsuo, Kyoto, JP;

Takeharu Ishii, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/56 (2006.01); H01L 21/67 (2006.01); H01L 21/48 (2006.01); H01L 21/02 (2006.01); H01L 21/687 (2006.01); H01L 21/033 (2006.01);
U.S. Cl.
CPC ...
C23C 16/56 (2013.01); H01L 21/02337 (2013.01); H01L 21/4871 (2013.01); H01L 21/6715 (2013.01); H01L 21/6719 (2013.01); H01L 21/67098 (2013.01); H01L 21/67103 (2013.01); H01L 21/67109 (2013.01); H01L 21/67126 (2013.01); H01L 21/67178 (2013.01); H01L 21/68742 (2013.01); H01L 21/02318 (2013.01); H01L 21/0337 (2013.01);
Abstract

Disclosed is a substrate treating method for performing a heat treatment of a substrate in a heat treating space. The method includes a loading step of loading the substrate on support pins, an exhaust step of exhausting gas within the heat treating space, an inert gas supply step of supplying inert gas into the heat treating space, an under-substrate space gas discharging step of discharging gas within an under-substrate space between the substrate and the top face of the heat treating plate, and a heat treating step of retracting the support pins into the heat treating plate, and performing the heat treatment of the substrate placed on the top face of the heat treating plate in the heat treating space.


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