The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2021
Filed:
Sep. 25, 2018
Applicant:
Sika Technology Ag, Baar, CH;
Inventor:
John Hanley, Sterling Heights, MI (US);
Assignee:
SIKA TECHNOLOGY AG, Baar, CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/00 (2006.01); C08G 59/40 (2006.01); C08G 59/42 (2006.01); B32B 7/12 (2006.01); B32B 15/01 (2006.01); C09J 5/06 (2006.01); C09J 11/06 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); B32B 7/12 (2013.01); B32B 15/011 (2013.01); B32B 15/016 (2013.01); C08G 59/4021 (2013.01); C08G 59/42 (2013.01); C09J 5/06 (2013.01); C09J 11/06 (2013.01); C09J 2463/00 (2013.01);
Abstract
A one-component thermosetting epoxy resin adhesive, including a) at least one epoxy resin A having on average more than one epoxide group per molecule; b) at least one latent hardener for epoxy resins; and c) at least one carboxylic acid selected from substituted or unsubstituted succinic acid and substituted or unsubstituted phthalic acid, wherein the epoxy resin adhesive contains 1.7 to 15 mmol of the at least one carboxylic acid per 100 g of epoxy resin adhesive, and the epoxy resin adhesive has a viscosity of more than 10 000 Pas at 25° C.