The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2021
Filed:
Jan. 31, 2017
Applicant:
Nitto Denko Corporation, Ibaraki, JP;
Inventors:
Takeshi Saito, Ibaraki, JP;
Noritsugu Daigaku, Ibaraki, JP;
Yasuaki Okada, Ibaraki, JP;
Keisuke Kimura, Ibaraki, JP;
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08F 2/50 (2006.01); C09J 4/00 (2006.01); C08L 101/02 (2006.01); C08L 43/00 (2006.01); C08F 30/06 (2006.01); C08L 101/00 (2006.01); G02B 1/14 (2015.01); C08F 2/44 (2006.01); C08F 20/56 (2006.01); C08K 5/55 (2006.01); C08K 5/56 (2006.01); C09J 201/02 (2006.01); C09J 201/06 (2006.01); G02B 1/00 (2006.01); C09J 11/06 (2006.01); G02B 1/18 (2015.01); B32B 7/12 (2006.01); B32B 23/08 (2006.01); B32B 23/20 (2006.01); B32B 27/08 (2006.01); B32B 27/30 (2006.01); G02B 5/30 (2006.01); G02F 1/1335 (2006.01);
U.S. Cl.
CPC ...
C09J 4/00 (2013.01); B32B 7/12 (2013.01); B32B 23/08 (2013.01); B32B 23/20 (2013.01); B32B 27/08 (2013.01); B32B 27/306 (2013.01); B32B 27/308 (2013.01); C08F 2/44 (2013.01); C08F 2/50 (2013.01); C08F 20/56 (2013.01); C08F 30/06 (2013.01); C08K 5/55 (2013.01); C08K 5/56 (2013.01); C08L 43/00 (2013.01); C08L 101/00 (2013.01); C08L 101/02 (2013.01); C09J 11/06 (2013.01); C09J 201/025 (2013.01); C09J 201/06 (2013.01); G02B 1/00 (2013.01); G02B 1/14 (2015.01); G02B 1/18 (2015.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2307/42 (2013.01); B32B 2457/20 (2013.01); G02B 5/3025 (2013.01); G02B 5/3033 (2013.01); G02F 1/133528 (2013.01);
Abstract
A curable resin composition, comprising a compound represented by the following general formula (1): wherein X is a functional group comprising a reactive group, and Rand Reach independently represent a hydrogen atom, or an aliphatic hydrocarbon group, aryl group or heterocyclic group that may have a substituent; and at least organometallic compound selected from the group consisting of metal alkoxides and metal chelates.