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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10899940 B1

PDFFull Text
Date of Patent:
Jan. 26, 2021

Filed:

Jan. 25, 2017

Interlayer printing process

Applicant:

Xerox Corporation, Norwalk, CT (US);

Inventors:

Naveen Chopra, Oakville, CA;

Chad Smithson, Toronto, CA;

Kurt Halfyard, Mississauga, CA;

Gail Song, Milton, CA;

Michelle Chretien, Mississauga, CA;

Assignee:

Xerox Corporation, Norwalk, CT (US);

Attorney:

Hoffman Warnick LLC

Primary Examiner:

Weiping Zhu

Int. Cl.
CPC ...
C09D 11/102 (2014.01); C09D 11/52 (2014.01); C09D 11/037 (2014.01); B22F 3/10 (2006.01); B22F 3/24 (2006.01); B22F 5/00 (2006.01); B22F 7/00 (2006.01); B22F 7/04 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); H05K 3/46 (2006.01); H05K 1/09 (2006.01); H05K 3/38 (2006.01); B29C 64/112 (2017.01); H05K 3/12 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
C09D 11/102 (2013.01); B22F 3/1021 (2013.01); B22F 3/24 (2013.01); B22F 5/00 (2013.01); B22F 7/008 (2013.01); B22F 7/04 (2013.01); B29C 64/112 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); C09D 11/037 (2013.01); C09D 11/52 (2013.01); H05K 1/092 (2013.01); H05K 3/386 (2013.01); H05K 3/4664 (2013.01); B22F 2003/248 (2013.01); B22F 2007/047 (2013.01); B22F 2301/255 (2013.01); B22F 2302/45 (2013.01); B22F 2303/40 (2013.01); B22F 2998/10 (2013.01); H05K 1/0284 (2013.01); H05K 1/097 (2013.01); H05K 3/1241 (2013.01); H05K 2201/09845 (2013.01); H05K 2203/0502 (2013.01);
Abstract

Disclosed herein as a printing method and system which includes providing a substrate and depositing an interlayer composition including a polymer selected from the group of epoxy resins, polyvinyl phenols and poly(melamine-co-formaldehyde) and an interlayer composition solvent on the substrate. The interlayer composition is cured to form cured interlayer. A conductive metal ink composition is deposited on the cured interlayer and the conductive metal ink composition is cured to form a solid metal trace on the cured interlayer.

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