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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10899856 B1

PDFFull Text
Date of Patent:
Jan. 26, 2021

Filed:

Oct. 04, 2018

Molding material, sheet molding compound and fiber-reinforced composite material

Applicant:

Mitsubishi Chemical Corporation, Chiyoda-ku, JP;

Inventors:

Yukichi Konami, Tokyo, JP;

Seiji Tsuchiya, Tokyo, JP;

Yuji Kazehaya, Tokyo, JP;

Assignee:

Mitsubishi Chemical Corporation, Chiyoda-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Camie S Thompson

Int. Cl.
CPC ...
C08F 12/08 (2006.01); C08J 5/04 (2006.01); C08J 5/24 (2006.01); C08F 283/01 (2006.01); C08G 18/79 (2006.01); C08G 18/68 (2006.01); C08F 2/44 (2006.01); C08G 18/22 (2006.01); C08J 5/10 (2006.01); C08K 3/10 (2018.01); C08K 3/11 (2018.01); C08K 3/04 (2006.01); C08K 7/02 (2006.01); C08F 20/18 (2006.01); C08F 20/32 (2006.01); C08K 5/56 (2006.01); C08F 220/30 (2006.01);
U.S. Cl.
CPC ...
C08F 12/08 (2013.01); C08F 2/44 (2013.01); C08F 20/18 (2013.01); C08F 20/32 (2013.01); C08F 283/01 (2013.01); C08G 18/222 (2013.01); C08G 18/68 (2013.01); C08G 18/797 (2013.01); C08J 5/04 (2013.01); C08J 5/10 (2013.01); C08J 5/24 (2013.01); C08K 3/04 (2013.01); C08K 3/10 (2013.01); C08K 3/11 (2018.01); C08K 5/56 (2013.01); C08K 7/02 (2013.01); C08F 220/305 (2020.02); C08J 2363/02 (2013.01); C08J 2363/10 (2013.01); C08J 2367/06 (2013.01); C08J 2375/04 (2013.01);
Abstract

The present invention provides a SMC of which excessive thickening with time is suppressed while of which sufficient initial thickening by an isocyanate-based thickener is maintained, particularly of which a decrease in flowability at the time of molding to be easily actualized in the case of containing an aromatic vinyl compound such as styrene is suppressed, and which exhibits excellent storage stability and moldability, a molding material for obtaining the SMC, and a fiber-reinforced composite material using the SMC. The invention provides a molding material including: a matrix resin composition containing the following Component (A), the following Component (B), the following Component (D) and the following Component (E); and the following Component (C), in which a proportion of the Component (E) with respect to 100 parts by mass of a sum of the Component (A) and the Component (B) is 0.002 part by mass or more and 0.08 part by mass or less:

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