The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2021
Filed:
Aug. 03, 2016
Applicant:
Made IN Space, Inc., Moffett Field, CA (US);
Inventor:
Michael Snyder, Mountain View, CA (US);
Assignee:
MADE IN SPACE, INC., Moffett Field, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 17/00 (2006.01); B64G 1/10 (2006.01); B33Y 40/00 (2020.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 80/00 (2015.01); B33Y 50/02 (2015.01); B33Y 70/00 (2020.01); B22F 3/105 (2006.01); B23K 5/18 (2006.01); B23K 9/04 (2006.01); B23K 11/00 (2006.01); B29C 64/386 (2017.01); B23K 15/00 (2006.01); B23K 26/342 (2014.01); B23K 37/04 (2006.01); B29C 64/106 (2017.01); B23K 10/02 (2006.01); B64G 1/66 (2006.01); B64G 1/52 (2006.01); B64G 1/26 (2006.01); B64G 1/50 (2006.01); B64G 4/00 (2006.01); B64G 99/00 (2009.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B64G 1/1078 (2013.01); B22F 3/1055 (2013.01); B23K 5/18 (2013.01); B23K 9/044 (2013.01); B23K 10/027 (2013.01); B23K 11/0013 (2013.01); B23K 15/0086 (2013.01); B23K 15/0093 (2013.01); B23K 26/342 (2015.10); B23K 37/0408 (2013.01); B23K 37/0461 (2013.01); B29C 64/106 (2017.08); B29C 64/386 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); B33Y 50/02 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); B64G 1/10 (2013.01); B64G 1/26 (2013.01); B64G 1/503 (2013.01); B64G 1/52 (2013.01); B64G 1/66 (2013.01); B64G 4/00 (2013.01); B64G 9/00 (2013.01); B22F 2003/1056 (2013.01); B29L 2031/3097 (2013.01); Y02P 10/295 (2015.11);
Abstract
A system for producing an object is disclosed including a build device having a build area and a material bonding component to receive portions of a material that are used to produce the object, at least one gripper within the build area to contact the object to provide support and to provide for at least one of a heat sink for the object, a cold sink for the object, and electrical dissipation path from the object, and a movement mechanism to move the build device relative to the object to position the build device at a position to further produce the object. Another system and methods are also disclosed.