The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2021

Filed:

Jun. 25, 2018
Applicant:

Autodesk, Inc., San Rafael, CA (US);

Inventor:

James Sherwood Page, Berkeley, CA (US);

Assignee:

Autodesk, Inc., San Rafael, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/118 (2017.01); B29C 64/393 (2017.01); B33Y 50/02 (2015.01); B29C 64/106 (2017.01);
U.S. Cl.
CPC ...
B29C 64/118 (2017.08); B29C 64/106 (2017.08); B29C 64/393 (2017.08); B33Y 50/02 (2014.12);
Abstract

A system for fabricating an object includes an extruder for one or more deposition materials. The extruder has at least one nozzle with a nozzle tip that includes an exit orifice and has a width that is equal to or larger than a width of the exit orifice. The system also includes a controller coupled with the extruder, the controller configured to apply a correction factor that has been calculated for a path of the nozzle based on a slope of a surface of an object to be fabricated. The correction factor for a positive slope is different from that for a negative slope. The extruder is configured to cause movement of the nozzle along the path to deposit material on the slope of the surface of the object, and the correction factor removes differences in thickness of the deposited material caused by the slope in relation to the path.


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