The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2021

Filed:

Apr. 04, 2016
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Chi Hao Chang, Taipei, TW;

Kuan-Ting Wu, Taipei, TW;

Yu-Ling Lin, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 11/06 (2006.01); C25D 11/02 (2006.01); C25D 11/30 (2006.01); C25D 11/34 (2006.01); C25D 11/04 (2006.01); B29C 45/00 (2006.01); B29C 39/10 (2006.01); B29C 45/14 (2006.01); B29K 101/12 (2006.01); B29K 705/00 (2006.01); B29K 509/08 (2006.01);
U.S. Cl.
CPC ...
B29C 45/0053 (2013.01); B29C 39/10 (2013.01); C25D 11/024 (2013.01); C25D 11/026 (2013.01); C25D 11/04 (2013.01); C25D 11/06 (2013.01); C25D 11/30 (2013.01); C25D 11/34 (2013.01); B29C 45/14 (2013.01); B29C 2045/0079 (2013.01); B29K 2101/12 (2013.01); B29K 2509/08 (2013.01); B29K 2705/00 (2013.01);
Abstract

The present subject matter relates to fabrication of micro-arc oxidation (MAO) based insert-molded components. In an example implementation, a method of fabricating a MAO based insert-molded component comprises forming an insert-molded component and oxidizing the insert-molded component through MAO. The insert-molded component has a metal body molded with a plastic body. On oxidation of the insert-molded component through MAO an oxide layer is formed on the metal body.


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