The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2021

Filed:

Mar. 16, 2017
Applicant:

Auburn University, Auburn, AL (US);

Inventors:

Brian Via, Opelika, AL (US);

Sujit Banerjee, Marietta, GA (US);

Assignee:

Auburn University, Auburn, AL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B27N 3/10 (2006.01); B27N 1/02 (2006.01); B27N 3/00 (2006.01); B27N 3/02 (2006.01); B27N 3/04 (2006.01); C09J 161/24 (2006.01); C08L 61/06 (2006.01); C08G 18/64 (2006.01); C09J 161/06 (2006.01); C08L 61/24 (2006.01); C08G 18/76 (2006.01); C08L 97/02 (2006.01); C08L 89/00 (2006.01);
U.S. Cl.
CPC ...
B27N 3/10 (2013.01); B27N 1/0209 (2013.01); B27N 3/002 (2013.01); B27N 3/02 (2013.01); B27N 3/04 (2013.01); C08G 18/6446 (2013.01); C08G 18/7671 (2013.01); C08L 61/06 (2013.01); C08L 61/24 (2013.01); C08L 89/00 (2013.01); C08L 97/02 (2013.01); C09J 161/06 (2013.01); C09J 161/24 (2013.01);
Abstract

Engineered wood products and binder compositions are provided. In preferred embodiments, the engineered wood products include wax. Methods are also provided for formulating binders for wood comprising unmodified soy flour and synthetic adhesives. The soy-based formulations are prepared by mixing unmodified soy flour with the synthetic adhesive prior to application to the wood or by adding them sequentially to the wood. The present invention provides adequate bonding at reduced cost.


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