The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2021

Filed:

Mar. 20, 2015
Applicant:

Mitsubishi Heavy Industries, Ltd., Tokyo, JP;

Inventor:

Hitoshi Yoshimura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/03 (2006.01); B23K 26/342 (2014.01); B33Y 30/00 (2015.01); B23K 26/144 (2014.01); B23K 26/06 (2014.01); B33Y 10/00 (2015.01); B22F 3/105 (2006.01); B23K 26/00 (2014.01); B23K 26/14 (2014.01); B23K 26/082 (2014.01); B23K 26/12 (2014.01); B23K 26/04 (2014.01); B22F 3/16 (2006.01); B33Y 50/02 (2015.01); B23K 103/02 (2006.01); B23K 103/10 (2006.01); B23K 103/12 (2006.01); B23K 103/14 (2006.01);
U.S. Cl.
CPC ...
B23K 26/342 (2015.10); B22F 3/1055 (2013.01); B22F 3/16 (2013.01); B23K 26/0093 (2013.01); B23K 26/034 (2013.01); B23K 26/0342 (2015.10); B23K 26/04 (2013.01); B23K 26/0608 (2013.01); B23K 26/0643 (2013.01); B23K 26/0648 (2013.01); B23K 26/082 (2015.10); B23K 26/127 (2013.01); B23K 26/144 (2015.10); B23K 26/1476 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B22F 2003/1056 (2013.01); B22F 2003/1057 (2013.01); B22F 2301/052 (2013.01); B22F 2301/10 (2013.01); B22F 2301/205 (2013.01); B22F 2301/35 (2013.01); B22F 2998/10 (2013.01); B23K 2103/02 (2018.08); B23K 2103/10 (2018.08); B23K 2103/12 (2018.08); B23K 2103/14 (2018.08); Y02P 10/25 (2015.11);
Abstract

A three-dimensional deposition device and a three-dimensional deposition method used to highly accurately manufacture a three-dimensional object are provided. A three-dimensional deposition device for forming a three-dimensional shape by depositing a formed layer on a base unit includes: a powder supply unit which supplies a powder material; a light irradiation unit which irradiates the powder material with a light beam so that at least a part of the powder material irradiated with the light beam is sintered or melted and solidified to form the formed layer; a heating unit which selectively heats an area having passed through a position irradiated with the light beam in the base unit or the formed layer or an area not having passed through the position irradiated with the light beam; and a control device which controls operations of the powder supply unit, the light irradiation unit, and the heating unit.


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