The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2021

Filed:

Sep. 10, 2014
Applicant:

Thinxxs Microtechnology Ag, Zweibrücken, DE;

Inventor:

Lutz Weber, Zweibrücken, DE;

Assignee:

THINXXS MICROTECHNOLOGY AG, Zweibrücken, DE;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01); B29C 65/16 (2006.01); B29C 65/48 (2006.01); B29K 33/00 (2006.01); B29L 9/00 (2006.01); B29K 21/00 (2006.01);
U.S. Cl.
CPC ...
B01L 3/502707 (2013.01); B29C 65/16 (2013.01); B29C 65/48 (2013.01); B01L 2200/0689 (2013.01); B01L 2200/12 (2013.01); B01L 2300/041 (2013.01); B01L 2300/0816 (2013.01); B01L 2300/0848 (2013.01); B01L 2300/0858 (2013.01); B01L 2400/0481 (2013.01); B01L 2400/0655 (2013.01); B29K 2021/003 (2013.01); B29K 2033/12 (2013.01); B29L 2009/00 (2013.01);
Abstract

A method for forming a microchannel or microfluidic reservoir is described. Methods provided herein include applying a covering over a recess formed in a substrate and bonding the covering to the substrate along seams. Methods provided herein use a substrate having elevated edge regions bordering the recess that project from the surface of the substrate. Bonding seams nm a distance from the elevated edge regions of the recess such that the covering and the elevated edge regions are pressed against each other. Devices for bonding substrates and coverings to make microchannels and microfluidic reservoirs are also provided herein. Devices provided herein can include pressing elements for holding the substrate and the covering together. Pressing elements provided herein can include recesses and/or elastic layers positioned opposite to one or more recesses in a substrate.


Find Patent Forward Citations

Loading…