The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 2021
Filed:
Jan. 22, 2020
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventors:
Koji Noguchi, Yokohama, JP;
Yusuke Hashimoto, Tachikawa, JP;
Assignee:
CANON KABUSHIKI KAISHA, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/34 (2006.01); H01L 23/498 (2006.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H01L 23/49838 (2013.01); H01L 23/562 (2013.01); H01L 24/16 (2013.01); H05K 1/0271 (2013.01); H05K 1/181 (2013.01); H05K 3/3436 (2013.01); H05K 3/3452 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 2224/16105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16237 (2013.01); H01L 2924/1511 (2013.01); H01L 2924/3511 (2013.01); H05K 2201/099 (2013.01); H05K 2201/0989 (2013.01); H05K 2201/09136 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/09409 (2013.01); H05K 2201/10719 (2013.01); H05K 2201/10734 (2013.01); Y02P 70/50 (2015.11);
Abstract
Provided is a printed wiring board comprising: a substrate; a conductive layer including a land and a wiring and formed on a surface of the substrate, the wiring having a width smaller than the land and drawn from the land; and an insulating layer formed on the conductive layer. The insulating layer has an opening corresponding to a position of the land, and an edge of the opening runs above the land and above one of edges in a width direction of the wiring.