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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10897120 B1

PDFFull Text
Date of Patent:
Jan. 19, 2021

Filed:

Sep. 29, 2018

Externally-strain-engineered semiconductor photonic and electronic devices and assemblies and methods of making same

Applicant:

University of Houston System, Houston, TX (US);

Inventors:

Jae-Hyun Ryou, Katy, TX (US);

Shahab Shervin, Houston, TX (US);

Seung Hwan Kim, Houston, TX (US);

Assignee:

UNIVERSITY OF HOUSTON SYSTEM, Houston, TX (US);

Attorney:

Conley Rose, P.C.

Primary Examiner:

Matthew C Landau

Assistant Examiner:

Dmitriy Yemelyanov

Int. Cl.
CPC ...
H01L 33/48 (2010.01); H01S 5/32 (2006.01); H01L 29/778 (2006.01); H01L 29/84 (2006.01); H01L 29/06 (2006.01); H01L 21/8238 (2006.01); H01L 29/49 (2006.01); H01L 29/78 (2006.01); H01S 5/323 (2006.01); H01S 5/34 (2006.01); H01L 29/10 (2006.01); H01L 29/20 (2006.01); H01L 29/22 (2006.01); H01L 33/02 (2010.01);
U.S. Cl.
CPC ...
H01S 5/3201 (2013.01); H01L 21/823807 (2013.01); H01L 21/823814 (2013.01); H01L 21/823835 (2013.01); H01L 29/0657 (2013.01); H01L 29/4908 (2013.01); H01L 29/7786 (2013.01); H01L 29/7845 (2013.01); H01L 29/84 (2013.01); H01S 5/32391 (2013.01); H01S 5/3406 (2013.01); H01L 29/1054 (2013.01); H01L 29/2003 (2013.01); H01L 29/22 (2013.01); H01L 33/02 (2013.01); H01L 33/486 (2013.01);
Abstract

Externally-strained devices such as LED and FET structures as discussed herein may have strain applied before or during their being coupled to a housing or packaging substrate. The packaging substrate may also be strained prior to receiving the structure. The strain on the devices enables modulation of light intensity, color, and electrical currents in some embodiments, and in alternate embodiments, enables a fixed strain to be induced and maintained in the structures.

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Quick Actions:

Ryou, Jae-Hyun. (2021). Externally-strain-engineered semiconductor photonic and electronic devices and assemblies and methods of making same (U.S. Patent No. 10897120). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10897120

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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