The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2021

Filed:

Feb. 22, 2019
Applicant:

Light Corp Inc., Grand Haven, MI (US);

Inventors:

Peter Bombara, Holland, MI (US);

Josh Bordewyk, Grand Haven, MI (US);

Cody Cole, Grant, MI (US);

Mike Myers, Muskegon, MI (US);

Greg Swears, Spring Lake, MI (US);

Andrew Zeiler, Coopersville, MI (US);

Brandon Nickolas, Muskegon, MI (US);

Assignee:

Light Corp Inc., Grand Haven, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 13/62 (2006.01); H01R 25/16 (2006.01); A47F 10/00 (2006.01); H01R 4/2483 (2018.01); H01R 33/88 (2006.01); H05K 5/02 (2006.01); H02G 3/38 (2006.01); H01R 25/14 (2006.01);
U.S. Cl.
CPC ...
H01R 33/88 (2013.01); A47F 10/00 (2013.01); H01R 13/6205 (2013.01); H01R 25/147 (2013.01); H01R 25/161 (2013.01); H02G 3/388 (2013.01); H05K 5/0247 (2013.01); H01R 4/2483 (2013.01);
Abstract

A power distribution system includes a panel assembly that has an outer surface and two conductive structures spaced from each other and spanning beneath the outer surface. An application module is configured to engage one of a plurality of locations disposed over the outer surface of the panel assembly. The application module includes a first contact configured to engage the first conductive structure and a second contact configured to engage the second conductive structure. The second contact is electrically insulated from the first contact and the first conductive structure for the panel assembly to deliver low voltage power to the engaged application module.


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