The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2021

Filed:

Jan. 18, 2019
Applicant:

Seagate Technology Llc, Fremont, CA (US);

Inventors:

Dana Lynn Simonson, Owatonna, MN (US);

John Wayne Shaw, II, Frederick, CO (US);

Assignee:

Seagate Technology, LLC, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/04 (2006.01); H01M 4/66 (2006.01); H01G 9/08 (2006.01); H05K 1/16 (2006.01); H01G 11/78 (2013.01); H01G 11/82 (2013.01); H01G 2/10 (2006.01); H01G 4/224 (2006.01); H01M 2/10 (2006.01); H01M 10/42 (2006.01); H01G 9/15 (2006.01); H01G 9/00 (2006.01);
U.S. Cl.
CPC ...
H01M 4/04 (2013.01); H01G 2/10 (2013.01); H01G 2/106 (2013.01); H01G 4/224 (2013.01); H01G 9/08 (2013.01); H01G 11/78 (2013.01); H01G 11/82 (2013.01); H01M 2/1022 (2013.01); H01M 4/663 (2013.01); H01M 10/425 (2013.01); H01M 10/4257 (2013.01); H05K 1/162 (2013.01); H01G 9/0029 (2013.01); H01G 9/15 (2013.01); H05K 2201/026 (2013.01); H05K 2201/0999 (2013.01); H05K 2201/10371 (2013.01); H05K 2201/10969 (2013.01); Y02E 60/13 (2013.01);
Abstract

Technologies are described herein for implementing a space-efficient internal energy storage apparatus in a data storage device or other electronic device have a metallic or otherwise electrically-conductive housing or case structure. A first carbon layer is applied to an inner surface of the metallic housing, and a dielectric spacer is applied upon the first carbon layer. Next, a conductive layer having a second carbon layer is applied over the dielectric spacer, and the metallic housing and the conductive layer is electrically connected to a circuitry of the electronic device.


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