The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2021

Filed:

Apr. 01, 2019
Applicant:

Sct Ltd., Grand Cayman, KY;

Inventors:

Shihfeng Shao, Milpitas, CA (US);

Chang Hung Pan, Milpitas, CA (US);

Heng Liu, Milpitas, CA (US);

Eric Li, Milpitas, CA (US);

Assignee:

SCT LTD., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 33/62 (2010.01); H01L 25/13 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 22/14 (2013.01); H01L 25/13 (2013.01); H01L 33/62 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01);
Abstract

An LED display module includes an LED package having one or more layers of molding compound and containing an array of LED chips disposed therein, a plurality of conductive pads disposed on a surface of the LED package away from the array of LED chips, a network of conductive tracks connecting the array of LED chips with each other, and a plurality of conductive paths connecting the plurality of conductive pads and the network of conductive tracks. The network of conductive tracks includes a first layer of conductive tracks connecting the array of LED chips with each other, and a second layer of conductive tracks disposed substantially between the first layer of conductive tracks and the plurality of conductive pads.


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