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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10896892 B1

PDFFull Text
Date of Patent:
Jan. 19, 2021

Filed:

Mar. 09, 2015

Wire bonding apparatus

Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventors:

Fumihiko Momose, Nagano, JP;

Takashi Saito, Matsumoto, JP;

Kazumasa Kido, Matsumoto, JP;

Yoshitaka Nishimura, Azumino, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:

Rabin & Berdo, P.C.

Primary Examiner:

Erin B Saad

Int. Cl.
CPC ...
B23K 20/00 (2006.01); H01L 23/00 (2006.01); B23K 20/10 (2006.01);
U.S. Cl.
CPC ...
H01L 24/78 (2013.01); H01L 24/85 (2013.01); B23K 20/004 (2013.01); B23K 20/10 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/05599 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/4847 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/789 (2013.01); H01L 2224/78252 (2013.01); H01L 2224/78313 (2013.01); H01L 2224/78353 (2013.01); H01L 2224/78611 (2013.01); H01L 2224/859 (2013.01); H01L 2224/85048 (2013.01); H01L 2224/85099 (2013.01); H01L 2224/85181 (2013.01); H01L 2224/85201 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85207 (2013.01); H01L 2224/85399 (2013.01); H01L 2924/00014 (2013.01);
Abstract

Provided is a wire bonding apparatus for electrically connecting an electrode and an aluminum alloy wire to each other by wire bonding. The apparatus includes a wire feeding device which feeds the wire. The wire has a diameter not less than 500 μm and not greater than 600 μm. The apparatus includes a heating device heats the wire to a temperature that is not lower than 50° C. and not higher than 100° C. The apparatus further includes a pressure device which presses the wire against the electrode. The apparatus further includes an ultrasonic wave generating device which generates an ultrasonic vibration that is applied to the wire that is pressed by the pressure device.

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