The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2021

Filed:

Mar. 15, 2019
Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventors:

Yu Suzuki, Yokohama, JP;

Shoko Kikuchi, Kawasaki, JP;

Merii Inaba, Kamakura, JP;

Jun Murakami, Yokohama, JP;

Takashi Shigeoka, Fujisawa, JP;

Hiroshi Inagaki, Chigasaki, JP;

Takashi Okuhata, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 24/49 (2013.01); H01L 24/09 (2013.01); H01L 25/18 (2013.01); H01L 2224/49107 (2013.01); H01L 2224/49174 (2013.01); H01L 2924/1434 (2013.01);
Abstract

A semiconductor device includes: a semiconductor substrate; a plurality of first pad electrodes provided above the semiconductor substrate; a plurality of first wires electrically connected to the plurality of first pad electrodes respectively; a first electrode commonly connected to the plurality of first wires; a second pad electrode provided above the semiconductor substrate; and a first resistance portion and a first protective element that are connected in series between the first electrode and the second pad electrode.


Find Patent Forward Citations

Loading…