The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 2021
Filed:
Feb. 21, 2019
Samsung Electronics Co., Ltd., Suwon-si, KR;
Yong Koon Lee, Suwon-si, KR;
Jin Su Kim, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a frame having a first through-hole, a semiconductor chip having an active surface on which a connection pad is disposed; a first encapsulant encapsulating at least a portion of the semiconductor chip; a second encapsulant disposed on at least a portion of the external side surface of the frame, and a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad of the semiconductor chip. The frame includes an insulating layer, a wiring layer disposed on upper and lower surfaces of the insulating layer, a first metal layer on the external side wall of the insulating layer, a second metal layer on the internal side wall of the first through hole, and a via penetrating the upper and lower surfaces of the insulating layer.