The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2021

Filed:

Oct. 18, 2018
Applicant:

Fujitsu Limited, Kawasaki, JP;

Inventors:

Tomoyuki Akahoshi, Atsugi, JP;

Masaharu Furuyama, Chigasaki, JP;

Daisuke Mizutani, Sagamihara, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01G 4/228 (2006.01); H01L 23/498 (2006.01); H01G 4/33 (2006.01); H05K 1/16 (2006.01); H01L 23/48 (2006.01); H01L 49/02 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5223 (2013.01); H01G 4/228 (2013.01); H01G 4/33 (2013.01); H01L 23/481 (2013.01); H01L 23/498 (2013.01); H01L 28/40 (2013.01); H05K 1/115 (2013.01); H05K 1/16 (2013.01); H05K 1/162 (2013.01); H01L 2224/16225 (2013.01); H05K 1/113 (2013.01); H05K 3/4602 (2013.01); H05K 2201/0175 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/092 (2013.01); H05K 2201/0959 (2013.01);
Abstract

A circuit board includes an insulating layer; a capacitor which is provided in the insulating layer and includes a dielectric layer, a first conductor layer provided on a first surface of the dielectric layer and including a first opening part, and a second conductor layer provided on a second surface opposite to the first surface of the dielectric layer and including a second opening part at a position corresponding to the first opening part; a first conductor via provided in the insulating layer, penetrating the dielectric layer, the first opening part and the second opening part, and being smaller than the first opening part and the second opening part in plan view; a second conductor via provided in the insulating layer and making contact with the second conductor layer; and a third conductor layer provided on the insulating layer and electrically coupled to the first and the second conductor vias.


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