The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 2021
Filed:
Apr. 22, 2019
Applicant:
Raytheon Company, Waltham, MA (US);
Inventors:
David D. Heston, Waltham, MA (US);
John G. Heston, Waltham, MA (US);
Claire E. Mooney, Waltham, MA (US);
Mikel J. White, Waltham, MA (US);
Jon Mooney, Waltham, MA (US);
Tiffany Cassidy, Waltham, MA (US);
Assignee:
Raytheon Company, Waltham, MA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/46 (2006.01); H01L 23/48 (2006.01); H01L 23/66 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/535 (2006.01); H01L 23/538 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/66 (2013.01); H01L 2223/6683 (2013.01);
Abstract
An HPA MMIC assembly includes a MMIC device coupled to a thermal spreader. A ground plane is provided on the thermal spreader and coupled to FETs in the MMIC device. The multiple levels of metal separated by multiple dielectric layers provide low-loss broad-band microstrip circuits. The thermal spreader may include diamond, an air/wire-edm spreader or a multi-layer board (MLB) with heat sink vias and ground vias.