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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10896861 B1

PDFFull Text
Date of Patent:
Jan. 19, 2021

Filed:

Apr. 22, 2019

Heterogeneous multi-layer mmic assembly

Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

David D. Heston, Waltham, MA (US);

John G. Heston, Waltham, MA (US);

Claire E. Mooney, Waltham, MA (US);

Mikel J. White, Waltham, MA (US);

Jon Mooney, Waltham, MA (US);

Tiffany Cassidy, Waltham, MA (US);

Assignee:

Raytheon Company, Waltham, MA (US);

Attorneys:

Burns & Levinson, LLP

Joseph M. Maraia

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/46 (2006.01); H01L 23/48 (2006.01); H01L 23/66 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/535 (2006.01); H01L 23/538 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/66 (2013.01); H01L 2223/6683 (2013.01);
Abstract

An HPA MMIC assembly includes a MMIC device coupled to a thermal spreader. A ground plane is provided on the thermal spreader and coupled to FETs in the MMIC device. The multiple levels of metal separated by multiple dielectric layers provide low-loss broad-band microstrip circuits. The thermal spreader may include diamond, an air/wire-edm spreader or a multi-layer board (MLB) with heat sink vias and ground vias.

Find Patent Forward Citations

Heston, David. (2021). Heterogeneous multi-layer mmic assembly (U.S. Patent No. 10896861). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10896861

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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