The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2021

Filed:

Jan. 13, 2020
Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventors:

Tomoaki Inokuchi, Yokohama Kanagawa, JP;

Katsuhiko Koui, Yokohama Kanagawa, JP;

Naoharu Shimomura, Meguro Tokyo, JP;

Hideyuki Sugiyama, Kawasaki Kanagawa, JP;

Kazutaka Ikegami, Inagi Tokyo, JP;

Susumu Takeda, Kawasaki Kanagawa, JP;

Satoshi Takaya, Kawasaki Kanagawa, JP;

Shinobu Fujita, Koto Tokyo, JP;

Hiroaki Yoda, Kawasaki Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 11/00 (2006.01); G11C 11/16 (2006.01); H01L 43/02 (2006.01); H01L 27/22 (2006.01); H01L 43/10 (2006.01);
U.S. Cl.
CPC ...
G11C 11/161 (2013.01); G11C 11/1659 (2013.01); G11C 11/1673 (2013.01); H01L 27/228 (2013.01); H01L 43/02 (2013.01); H01L 43/10 (2013.01);
Abstract

According to one embodiment, a magnetic memory device includes a conductive member, a first element portion, and a controller. The conductive member includes a first portion, a second portion, and a third portion between the first portion and the second portion. The first element portion includes a first element, a first interconnect, and a first circuit. The first element includes a first magnetic layer, a first counter magnetic layer, and a first nonmagnetic layer. The first counter magnetic layer is provided between the third portion and the first magnetic layer. The first nonmagnetic layer is provided between the first counter magnetic layer and the first magnetic layer. The first interconnect is electrically connected to the first magnetic layer. The first circuit is electrically connected to the first interconnect. The first circuit includes a first switch, a first capacitance element, a first parallel switch, and a first parallel capacitance element.


Find Patent Forward Citations

Loading…