The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2021

Filed:

Feb. 19, 2020
Applicants:

Ryohei Matsuda, Kanagawa, JP;

Hiroyuki Shimada, Tokyo, JP;

Inventors:

Ryohei Matsuda, Kanagawa, JP;

Hiroyuki Shimada, Tokyo, JP;

Assignee:

Ricoh Company, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03G 15/20 (2006.01);
U.S. Cl.
CPC ...
G03G 15/2053 (2013.01); G03G 15/206 (2013.01); G03G 15/2007 (2013.01); G03G 15/2064 (2013.01); G03G 15/2039 (2013.01); G03G 2215/2035 (2013.01);
Abstract

A fixing device that includes a rotatable endless fixing member, a fixing heat source which heats the fixing member, a pressure member provided on the outside of the fixing member and facing the fixing member, a nip forming member provided inside the fixing member and forming a fixing nip between the fixing member and the pressure member, a nip forming support member for supporting the nip forming member, a high-thermal-conductive member provided between the fixing member and the nip forming member, an adhesive provided between the high-thermal-conductive member and the nip forming member. The thermal conductivity of the adhesive is larger than the thermal conductivity of the nip forming member and lower than the thermal conductivity of the high-thermal-conductive member.


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