The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2021

Filed:

Jul. 07, 2017
Applicant:

Divergent Technologies, Inc., Los Angeles, CA (US);

Inventors:

Antonio Bernerd Martinez, El Segundo, CA (US);

Eahab Nagi El Naga, Topanga, CA (US);

David Brian TenHouten, Los Angeles, CA (US);

John Russell Bucknell, El Segundo, CA (US);

Broc William TenHouten, Rancho Palos Verdes, CA (US);

Chukwubuikem Marcel Okoli, Los Angeles, CA (US);

Thomas Samuel Bowden, Jr., Los Angeles, CA (US);

Muhammad Faizan Zafar, Long Beach, CA (US);

Assignee:

Divergent Technologies, Inc., Los Angeles, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/10 (2006.01); F16H 57/029 (2012.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); B32B 1/08 (2006.01); B32B 15/04 (2006.01); B32B 37/12 (2006.01); B32B 7/12 (2006.01); B32B 37/24 (2006.01); B32B 3/06 (2006.01); B23K 26/342 (2014.01); F16H 57/032 (2012.01); B22F 7/08 (2006.01); F16H 57/04 (2010.01); B22F 3/105 (2006.01); F16H 57/02 (2012.01);
U.S. Cl.
CPC ...
F16H 57/029 (2013.01); B22F 7/08 (2013.01); B23K 26/342 (2015.10); B32B 1/08 (2013.01); B32B 3/06 (2013.01); B32B 7/12 (2013.01); B32B 15/043 (2013.01); B32B 37/12 (2013.01); B32B 37/24 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); F16H 57/032 (2013.01); B22F 3/1055 (2013.01); B32B 2597/00 (2013.01); F16H 57/0423 (2013.01); F16H 2057/02017 (2013.01);
Abstract

Techniques for joining nodes and subcomponents are presented herein. An additively manufactured first node or subcomponent has a groove. An additively manufactured second node or subcomponent has a tongue configured to extend into and mate with the groove to form a tongue-and-groove connection between the first and second node or subcomponent. In some aspects, the tongue-groove connection may extend substantially around a periphery of the node or subcomponent. In other aspects, a first subcomponent having a fluid pipe interface may be coupled via a tongue-groove connection to a second subcomponent having a fluid pipe interface, thereby enabling fluid to flow between subcomponents of the resulting integrated component.


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