The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2021

Filed:

Feb. 02, 2016
Applicant:

Reifenhaeuser Gmbh & Co. KG Maschinenfabrik, Troisdorf, DE;

Inventors:

Sebastian Sommer, Troisdorf, DE;

Morten Rise Hansen, Aalborg, DK;

Mikael Staal Axelsen, Hjallerup, DK;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/26 (2006.01); B29C 70/50 (2006.01); B32B 37/24 (2006.01); B32B 37/00 (2006.01); B32B 5/02 (2006.01); B32B 7/02 (2019.01); D04H 3/147 (2012.01); D04H 1/4374 (2012.01); D04H 3/018 (2012.01); B32B 5/10 (2006.01); B32B 5/08 (2006.01); B32B 5/06 (2006.01); B32B 5/12 (2006.01); B29K 23/00 (2006.01); B29L 9/00 (2006.01);
U.S. Cl.
CPC ...
B32B 5/26 (2013.01); B29C 70/508 (2013.01); B32B 5/022 (2013.01); B32B 5/06 (2013.01); B32B 5/08 (2013.01); B32B 5/10 (2013.01); B32B 5/12 (2013.01); B32B 7/02 (2013.01); D04H 1/4374 (2013.01); D04H 3/018 (2013.01); D04H 3/147 (2013.01); B29K 2023/06 (2013.01); B29K 2023/12 (2013.01); B29L 2009/00 (2013.01); B32B 2250/02 (2013.01); B32B 2250/20 (2013.01); B32B 2262/0253 (2013.01); B32B 2262/12 (2013.01); B32B 2262/14 (2013.01); B32B 2305/20 (2013.01); B32B 2307/546 (2013.01); B32B 2307/732 (2013.01); B32B 2555/02 (2013.01);
Abstract

A laminate is made by first non-crimping or low-crimping continuous filaments to form a first spunbond layer and preconsolidating the first spunbond layer with a heated or calendering roller. Then continuous filaments with a greater crimp than the continuous filaments of the first spunbond layer are deposited as a second spunbond layer over the first spunbond layer to create a two-layer structure. Finally, the two-layer structure of the first and second spunbond layers is consolidated such that a total thickness of the laminate is 0.15 to 3 mm, preferably 0.2 mm to 2.5 mm and especially 0.2 mm to 2 mm.


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