The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2021

Filed:

Oct. 07, 2016
Applicant:

Global Filtration Systems, Dearborn Heights, MI (US);

Inventors:

Ali El-Siblani, Dearborn Heights, MI (US);

Alexandr Shkolnik, Los Angeles, CA (US);

Assignee:

Global Filtration Systems, Dearborn Heights, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/10 (2017.01); B29C 64/135 (2017.01); B33Y 10/00 (2015.01); B29C 64/129 (2017.01); B29C 64/40 (2017.01); B29C 64/245 (2017.01); B29C 64/255 (2017.01); B29C 64/264 (2017.01); B29C 33/44 (2006.01); B33Y 70/00 (2020.01); B33Y 30/00 (2015.01);
U.S. Cl.
CPC ...
B29C 64/135 (2017.08); B29C 33/44 (2013.01); B29C 64/129 (2017.08); B29C 64/245 (2017.08); B29C 64/255 (2017.08); B29C 64/264 (2017.08); B29C 64/40 (2017.08); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B29K 2827/12 (2013.01); B29K 2883/00 (2013.01); B33Y 30/00 (2014.12);
Abstract

A solidification substrate assembly for making a three-dimensional object from a solidifiable material includes a solidification substrate assembly. In certain examples, the solidifiable material solidifies in contact with the solidification substrate, and the tilting of the substrate and/or or the use of a peeling member facilitates separation of the substrate from the solidified material. In other examples, the solidification substrate assembly includes a film that is adjacent to a rigid or semi-rigid layer. The solidifiable material solidifies in contact with the film, and a peeling member peels the film away from the solidified material. Intelligent solidification substrate assemblies are also described in which a force sensor determines when to expose the solidifiable material to solidification energy and/or whether to use a peeling member to separate the solidification substrate from a solidified objection section.


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