The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2021

Filed:

Dec. 20, 2016
Applicant:

Jsp Corporation, Tokyo, JP;

Inventors:

Atsuo Takayama, Kanuma, JP;

Motoaki Ueguri, Utsunomiya, JP;

Keiichi Hashimoto, Nikko, JP;

Assignee:

JSP CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A47C 7/18 (2006.01); B60N 2/90 (2018.01); A47C 27/14 (2006.01); A47C 7/24 (2006.01); B60N 2/68 (2006.01); B29C 39/10 (2006.01); B60N 2/70 (2006.01); B29L 31/58 (2006.01); B60N 2/58 (2006.01);
U.S. Cl.
CPC ...
A47C 7/18 (2013.01); A47C 7/24 (2013.01); A47C 27/14 (2013.01); B29C 39/10 (2013.01); B60N 2/68 (2013.01); B60N 2/682 (2013.01); B60N 2/7017 (2013.01); B60N 2/90 (2018.02); B29L 2031/58 (2013.01); B32B 2266/0292 (2013.01); B60N 2/5825 (2013.01);
Abstract

A method for producing a seat core material that has a foamed molded substrate and a frame member embedded in a periphery thereof, which includes, as step (a), heating thermoplastic resin expanded beads in a mold cavity, in which the frame member has been disposed, to fusion-bond the expanded beads to each other and to obtain the foamed molded substrate with the frame member being embedded in the periphery thereof; and, as step (b), simultaneously with step (a) or after step (a), forming a void cavity S, S' in the foamed molded substrate at a position along and adjacent to the frame member. The void cavity S, S′ has a size and shape that allows a relative displacement between the frame member and the foamed molded substrate when the foamed molded substrate shrinks after step (b).


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